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GeezerVison is showing www.mipi.org — Interface Specifications for Mobile Products | MIPI Allliance

Moving Mobile Forward

Interface specifications for mobile, automotive, IoT and more

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Key MIPI Specifications

MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.

CSI-2®

MIPI Camera Serial Interface 2

A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors

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Banner Images - MIPI (1)-3

DSI-2™

MIPI Display Serial Interface 2

A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays

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Display

I3C®

MIPI Improved Inter Integrated Circuit

A scalable utility and control bus interface for connecting peripherals to an application processor

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AdobeStock_372513713

C-PHY™

Physical Layer


A physical layer for high-performance, cost-optimized cameras and displays

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Camera and Display

D-PHY™

Physical Layer

A physical layer for high-performance, cost-optimized cameras and displays

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AdobeStock_425310788

A-PHY®

Physical Layer

Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications

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car-1-1-1

SWI3S®

MIPI SoundWire I3S

A scalable, low-power, and noise-resilient embedded audio interface for all device form factors, large and small

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Banner Images - MIPI (8)-1-1

RFFE™

MIPI RF Front-End Control Interface

A control interface that simplifies integration of complex RF front-end devices

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Banner Images - MIPI (15)-1

See all MIPI Alliance specifications

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News & Events

Birds of a Feather (BoF) Groups

 

Physical AI BoF

Open to MIPI members and nonmembers interested in helping shape the future of MIPI specifications in humanoids

Join the BoF

 

Die-to-Die BoF

Open to all MIPI members interested in exploring potential new die-to-die or dual-purpose (die-to-die and chip-to-chip) solutions

Join the BoF

 

Press Releases 

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Blog

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Recent Specs

A-PHY® v2.1
Sept 2026

Debug Over USB v1.2
Sept 2026

SPP™  v2.2
April 2026

CCPAL/A™ v1.0
Mar 2026

CCPAL/U™ v1.0
Feb 2026

C-PHY™ v3.1
Dec 2025

CSI-2® v4.2
Dec 2025

Debug Over PCIe v1.0
Dec 2025

I3C TCRI™ v1.1
Dec 2025

M-PHY® v6.0
Dec 2025

RFFE™ v3.2
Dec 2025

CCISE™ v1.0
Nov 2025

Power Over A-PHY v1.1
Nov 2025

Security for Debug v1.0
Nov 2025

UniPro® v3.0
Nov 2025

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San-Fransico-Website

MIPI Member Meeting North America #74

1-5 March 2027
San Francisco, Calif., USA

Learn more »

EW-2027-Nuremberg-CFP-LI-Website-generic

embedded world 2027

16-18 March 2027
Nuremberg, Germany

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brussels updated

MIPI Member Meeting Europe #75

14-18 June 2027
Brussels, Belgium

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AdobeStock_310856432_Seoul_1

MIPI Member Meeting Asia #76

15-19 November 2027
Seoul, South Korea

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Application Areas

5g-1-1

5G

car-1-1-1-1

Automotive

IOTFEAT-1-1

Internet of Things

mobilefeat-1-1

Mobile

Board Member Companies

Google LLC Intel Corporation Qualcomm Incorporated Samsung Electronics, Co.
Sony Semiconductor Solutions Corporation STMicroelectronics Synopsys Inc. Texas Instruments

See all Board and Contributor level members

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