Luminovo opens its supply chain platform to AI assistants

German software company Luminovo is opening its platform for electronics quoting and procurement to AI assistants such as ChatGPT, Claude and Microsoft Copilot. EMS providers and electronics manufacturers will be able to query their own supply chain data in plain language, and build their own tools on top of it.

Arrow launches Capstone as dedicated IP&E business

Arrow Electronics has launched Capstone, a new global business dedicated to interconnect, passive and electromechanical (IP&E) components. The launch is part of a wider realignment of Arrow’s components business, which is moving from a geographic to a technology-based operating model.

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Ferrotec opens second plant in Kulim, Malaysia, with 1,000 new jobs

Ferrotec has opened its second manufacturing plant in Kulim, Malaysia, which will create more than 1,000 new jobs. The new plant brings the company’s total investment in its two Kulim sites to about MYR 1.9 billion.

Sivers signs global distribution agreement with WT Microelectronics

With a 15% global market share, WT Microelectronics will serve as a strong global distribution partner for Sivers’ InP (Indium Phosphide) lasers and wireless beamformer products and solutions, connecting its product portfolio and availability at scale with customers globally.

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Sanken, Kaynes to explore partnership in manufacturing LEDs, power devices

The collaboration seeks to boost the companies’ competitive position in India’s market. By leveraging their resources and capabilities, Sanken Electric and Kaynes aim to mitigate risks associated with fluctuations in demand while maximizing investment efficiency.

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Steliau Technology completes acquisition of Acal BFi

French electronics distributor Steliau Technology has completed its acquisition of the UK-based Acal BFi Group, which includes Impulse Embedded and Arcobel Embedded Solutions. The combined group will have revenue approaching EUR 1 billion.

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Amkor breaks ground on new building in South Korea

Amkor has broken ground on an expansion of its campus in Gwangju, South Korea, to meet rising demand for advanced packaging for AI and accelerated computing. The new building will add capacity at a site that has been part of Amkor’s Korean operations since the 1990s.

Infineon expects more than 20% growth as data centre power nears €4 billion

Infineon expects revenue of about EUR 20 billion in fiscal 2027, which runs from October 2026 to September 2027. That would be an increase of more than 20%, driven by data centres, power infrastructure and software-defined vehicles. Revenue from power supplies for data centres alone is projected to reach close to EUR 4 billion.

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SCHMID wins equipment order for glass core substrate plant in South Asia

German equipment maker SCHMID Group has received an order for wet-process equipment for a new glass core substrate plant in South Asia. The customer is a US company specialising in glass-based advanced packaging, which is now moving its technology from pilot production to industrial scale.

HCLTech, PTC to accelerate semiconductor product lifecycle management

The solution establishes a unified digital thread by connecting people, processes and data across the semiconductor lifecycle, from IP management, new product introduction and supplier collaboration to quality and regulatory compliance.

Foxconn, Mitsubishi Electric finalise alliance for automotive equipment business

Under the agreement, Mitsubishi Electric will transfer to Lin Yin 50% of its stake in Mitsubishi Electric Mobility, which handles Mitsubishi Electric’s automotive equipment business, after which the two co-owners will jointly operate Mitsubishi Electric Mobility.

Diamond Foundry says it has grown first 200 mm single-crystal diamond

US company Diamond Foundry says it has grown the first single-crystal diamond with a diameter of 200 mm, the same size as a standard semiconductor wafer. The company sees it as a step towards using diamond as a substrate material in chip manufacturing.

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Infineon processes first 300 mm SiC wafers into working power devices

Infineon has processed 300 mm silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria, using existing silicon manufacturing equipment. The company says it’s the first to do so in a full-scale semiconductor fab.

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Paras, BroadPak to develop advanced packaging facility in India

The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification.

Monolithic partners with GF to scale high-performance power solutions

Combining MPS’s technology with GF’s manufacturing expertise will support the next phase of growth for both companies while providing customers with greater capacity, supply assurance and global scale.

Nvidia, Rebellions, SK Telecom to advance sovereign AI infrastructure

Supported by Korea’s Ministry of Science and ICT (MSIT), the collaboration aims to support AI services tailored to Korea’s language, industries and priorities, connecting Korean semiconductor development with the systems and operational capabilities needed to deliver AI at scale

Nvidia investigates whether CEO Jensen Huang was targeted by foreign intelligence

Nvidia’s board of directors has launched an independent investigation following reports that CEO Jensen Huang has been the target of a foreign intelligence effort. The board says it has no reason to believe national security or the company’s secrets have been compromised, and that it has confidence in Huang.

onsemi scraps $2 billion SiC expansion in the Czech Republic

onsemi will not go ahead with the planned expansion of its site in Rožnov pod Radhoštěm, which would have added end-to-end silicon carbide (SiC) production in the Czech Republic. The company and the Czech Ministry of Industry and Trade have agreed to conclude the project, which was announced in June 2024 as an investment of up to USD 2 billion.

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MediaTek, Ericsson complete multi-vendor pre-6G trial with T-Mobile

This achievement marks the first time a leading service provider, leading network infrastructure provider and a leading chipset vendor have come together to demonstrate pre-6G technology with 400MHz channel bandwidth under realistic conditions in the field.

Mitsubishi Electric to form JV with ABB for low-voltage power distribution business

The target business encompasses low-voltage circuit breakers, electromagnetic switches, measurement and control equipment, and UPS for general industrial use of 5kVA or less, and other products.

Nexperia sues Wingtech for $2 billion in damages

Nexperia has taken legal action in the Netherlands against its Chinese parent Wingtech, Nexperia China and its former CEO, Zhang Xuezheng, seeking damages it currently estimates at USD 2 billion. At the same time, a Dutch court has granted Nexperia an injunction protecting its intellectual property rights in the EU.

Nordson acquires Swiss sensor maker Contrinex

Nordson has completed its acquisition of Contrinex, a Swiss maker of sensors for factory automation. The deal adds inductive and photoelectric position sensors to Nordson’s test and inspection business.

Intilion, CATL to deploy 3GWh sodium-ion energy storage in Europe

The two companies plan to deploy 3 GWh of CATL’s TENER energy storage systems across Germany, Switzerland, Austria and other markets over the next five years, serving both utility-scale and commercial and industrial (C&I) applications.

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WATS signs S-EV Electronic Distribution as partner in Germany

WATS has added German distributor S-EV Electronic Distribution to its partner network. The partnership is meant to give WATS a stronger presence among German electronics manufacturers.

Axcelis and Veeco push merger closing to Q1 2027

Axcelis Technologies and Veeco Instruments now expect their all-stock merger to close by the end of the first quarter of 2027. The deal is still waiting for approval from China’s competition authority, SAMR, and the companies must also refile with US regulators.

Australia’s LatConnect 60 expands India presence for SWIRSAT

NSIL, the commercial arm of India’s space program, has signed an agreement with Australian Earth observation satellite company LatConnect 60 to provide telemetry, tracking and command services for the company’s SWIRSAT-1 and SWIRSAT-2 spacecraft.

Bosch to set up dedicated semiconductor division, targets €5 billion in sales

Bosch will move its semiconductor business into a dedicated division from January 2028. The company aims to reach semiconductor sales of around EUR 5 billion by 2030, and plans to open up more of its manufacturing capacity to external customers.

LG CNS, D-Wave to advance quantum optimization adoption in Korea

The companies intend to combine D-Wave’s annealing quantum computing technologies with LG CNS’s industry expertise, mathematical optimization capabilities and systems integration experience to develop applications for customers in manufacturing, telecommunications, finance and retail.

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onsemi to acquire Ferric for $600 million

onsemi has agreed to acquire US company Ferric, which develops integrated voltage regulators (IVRs) for AI processors, for USD 600 million in cash. Another USD 175 million could follow if Ferric reaches certain revenue milestones.

Marvell to acquire Lumentum in $115 billion all-stock deal

Marvell Technology has agreed to acquire optical component maker Lumentum in an all-stock deal that values Lumentum at an enterprise value of USD 115 billion. The companies plan to combine Marvell’s electrical interconnect and custom silicon with Lumentum’s lasers and optical transceivers as AI data centres move from copper to optical connectivity.

IIT Guwahati, Tata Electronics to advance chip packaging research

With an aim to address the growing need for a skilled workforce in the Indian semiconductor industry, this collaboration will develop educational and training programs aligned with industry requirements.

Murata to invest €5.7 billion to double MLCC sales

Japanese component maker Murata plans to invest about JPY 1 trillion (about EUR 5.7 billion) over five years to expand its global production capacity for multilayer ceramic capacitors (MLCCs). The company expects MLCC sales in fiscal 2030 to be at least double those of fiscal 2025.

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