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Home > Home > Technical Papers

AI/ML/DL

  • Hardware-Based Location Checks Target AI Chip Smuggling (Texas A&M)
  • Embedded ECC Protects AI Weights Against Bit-Flip Attacks (University of Florida)
  • Analog Superposition Increases Effective PCM Storage Density (IBM Research Europe)
  • Security-Aware Layer Mapping Reduces Fault Vulnerability In 3D Compute-In-Memory (ASU, U. of Maryland)
  • Neural Networks Speed 3nm Nanosheet SPICE Simulation (TU Munich)
Show More »

Architectures

  • Hardware-Based Location Checks Target AI Chip Smuggling (Texas A&M)
  • Embedded ECC Protects AI Weights Against Bit-Flip Attacks (University of Florida)
  • Randomized Caches in HW: Overheads And Limitations (RUB, Max Planck, Georgia Tech)
  • Hardware Defense Blocks Memory-Dependent Prefetcher Leakage (KU Leuven)
  • Analog Superposition Increases Effective PCM Storage Density (IBM Research Europe)
Show More »

Automotive/ Aerospace

  • Thermal Side Channels Create New Security Risks For Autonomous Vehicles (Missouri S&T)
  • Formal Automotive Security Analysis Of CAN XL (Georgia Tech, QCRI, Purdue)
  • Chiplet Co-Design Framework Reduces Energy and Design Costs for AI Accelerators (University of Michigan)
  • Intrinsic Polarization Superjunctions Boost GaN-On-Silicon Power Devices (EPFL)
  • Hardware Abstraction Layer Study Targets Software-Defined Vehicles (U. of Stuttgart)
Show More »

Communication/Data Movement

  • Hardware-Based Location Checks Target AI Chip Smuggling (Texas A&M)
  • Silicon Photonic Modulator Reaches 200 Gb/s PAM4 With Reduced DSP (Science Tokyo, Yokohama, AIST, PETRA)
  • Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)
  • Formal Automotive Security Analysis Of CAN XL (Georgia Tech, QCRI, Purdue)
  • Programmable Silicon Photonics Filter Enables Continuous Laser Wavelength Tuning (UiT, Stanford)
Show More »

Design & Verification

  • Co-Optimizing Access Points Improves Analog Placement (UT Austin)
  • Neural Networks Speed 3nm Nanosheet SPICE Simulation (TU Munich)
  • Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)
  • A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)
  • Agentic AI Automates RTL Waveform Analysis And Debugging (Columbia, Google)
Show More »

Lithography

  • Pt-W Alloy Shows Potential For Thinner High-NA EUV Mask Absorbers (Chinese Academy of Sciences et al.)
  • Dry-Deposited Resist Shows Different Tone Behavior Under EUV And E-Beam Exposure (KU Leuven, Kunsan, VUB, Imec)
  • Hyper-NA EUV: The Next Extension Beyond High NA Lithography (Carl Zeiss, ASML)
  • Molybdenum Quasi Phase-Only Masks Improve EUV Imaging (NYCU, TSMC)
  • Defect Prediction in Optical Lithography, EUVL, and NIL (National Taiwan University)
Show More »

Manufacturing

  • Optimized E-Beam Evaporation Reduces Metal-Semiconductor Contact Degradation (RWTH Aachen)
  • Pt-W Alloy Shows Potential For Thinner High-NA EUV Mask Absorbers (Chinese Academy of Sciences et al.)
  • Dry-Deposited Resist Shows Different Tone Behavior Under EUV And E-Beam Exposure (KU Leuven, Kunsan, VUB, Imec)
  • Carbon-Dot Interface Enables Ultrathin High-κ Dielectrics on 2D Semiconductors (UIUC, NETL, Argonne, Monash)
  • Deterministic Nucleation Enables Controlled Growth of 2D Semiconductors (KAIST, TDS, Hanyang et al.)
Show More »

Materials

  • Single-Crystal High-κ Dielectric Enables Low-Power 2D CFETs (NUS et al.)
  • Optimized E-Beam Evaporation Reduces Metal-Semiconductor Contact Degradation (RWTH Aachen)
  • Fast, Sub-Volt HZO Ferroelectric Capacitors For DRAM-Like Memory (SNU)
  • Dry-Deposited Resist Shows Different Tone Behavior Under EUV And E-Beam Exposure (KU Leuven, Kunsan, VUB, Imec)
  • Carbon-Dot Interface Enables Ultrathin High-κ Dielectrics on 2D Semiconductors (UIUC, NETL, Argonne, Monash)
Show More »

Memory

  • Fast, Sub-Volt HZO Ferroelectric Capacitors For DRAM-Like Memory (SNU)
  • Analog Superposition Increases Effective PCM Storage Density (IBM Research Europe)
  • Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
  • Security-Aware Layer Mapping Reduces Fault Vulnerability In 3D Compute-In-Memory (ASU, U. of Maryland)
  • Nanoelectromechanical Switches Target More Efficient Embedded DRAM (UC Berkeley, Samsung, Intel)
Show More »

Optoelectronics / Photonics

  • Silicon Photonic Modulator Reaches 200 Gb/s PAM4 With Reduced DSP (Science Tokyo, Yokohama, AIST, PETRA)
  • Ultra-Compact Photonic Bends Reduce Loss While Meeting Foundry Rules (Georgia Tech)
  • Programmable Silicon Photonics Filter Enables Continuous Laser Wavelength Tuning (UiT, Stanford)
  • Ferroelectric Tuning Reduces Optical-Interconnect Stalls In LLM Training (Georgia Tech)
  • Rapid Switching of Optical Properties in a Doped Semiconductor By Femtosecond Laser Pulses (Imperial College London, U. of Exeter)
Show More »

Packaging

  • Hardware-Based Location Checks Target AI Chip Smuggling (Texas A&M)
  • AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)
  • 3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)
  • Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
  • A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)
Show More »

Power & Performance

  • Single-Crystal High-κ Dielectric Enables Low-Power 2D CFETs (NUS et al.)
  • Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)
  • Self-Heating And Parasitics Challenge Multi-Tier CFET Scaling (TU Munich, IIT Kanpur)
  • Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)
  • Nanoelectromechanical Switches Target More Efficient Embedded DRAM (UC Berkeley, Samsung, Intel)
Show More »

Quantum

  • Quantum Interconnects Link Two 120-Qubit Processors (IBM Research)
  • Room-temperature, CMOS-compatible Photonic Quantum Processor (NUS et al.)
  • Mapping and Routing Fault-Tolerant Quantum Circuits Onto Chiplet Architectures (TU Munich)
  • Simulations of Silicon Spin Qubits Based on a GAAFET (Teikyo U., Riken)
  • A Manufacturing Approach That Brings Diamond Quantum Photonics Closer To Industrial Production (MIT, KAUST et al.)
Show More »

Security

  • Hardware-Based Location Checks Target AI Chip Smuggling (Texas A&M)
  • Embedded ECC Protects AI Weights Against Bit-Flip Attacks (University of Florida)
  • Randomized Caches in HW: Overheads And Limitations (RUB, Max Planck, Georgia Tech)
  • Hardware Defense Blocks Memory-Dependent Prefetcher Leakage (KU Leuven)
  • Security-Aware Layer Mapping Reduces Fault Vulnerability In 3D Compute-In-Memory (ASU, U. of Maryland)
Show More »

Test, Measurement, Analytics tech papers

  • AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)
  • Molecular Dynamics Study Explains Aluminum Dopant Activation In 4H-SiC (TU Wien, Silvaco)
  • Deep Learning Automates Parameter Extraction For 2D Transistors (Stanford, SLAC)
  • Defect Prediction in Optical Lithography, EUVL, and NIL (National Taiwan University)
  • Failure Analysis HW Enables System-Level Debug For 3D ICs (Google, TU Delft)
Show More »

Transistors

  • Single-Crystal High-κ Dielectric Enables Low-Power 2D CFETs (NUS et al.)
  • Self-Heating And Parasitics Challenge Multi-Tier CFET Scaling (TU Munich, IIT Kanpur)
  • Neural Networks Speed 3nm Nanosheet SPICE Simulation (TU Munich)
  • Nanoelectromechanical Switches Target More Efficient Embedded DRAM (UC Berkeley, Samsung, Intel)
  • Simulations Pinpoint Leakage Pathway In GAAFETs (Sandia, Luxembourg)
Show More »

Z-End Applications

  • Energy-Aware DL: The Interplay Between NN Efficiency And Hardware Constraints (Imperial College London, Cambridge)
  • Overview Of Printed And Flexible Electronics: Technology Fundamentals, Design And Practical Applications
  • In-Depth Study of Low-Power MCUs For Wearables (EPFL)
  • Flexible IGZO RISC-V Microprocessor
  • Scalable Fabrication of Graphene FETs on Non-Planar Surfaces (Imperial College London)
Show More »

Technical Papers By Date

  • Hardware-Based Location Checks Target AI Chip Smuggling (Texas A&M) - 11-26
  • Embedded ECC Protects AI Weights Against Bit-Flip Attacks (University of Florida) - 11-26
  • Single-Crystal High-κ Dielectric Enables Low-Power 2D CFETs (NUS et al.) - 11-26
  • Optimized E-Beam Evaporation Reduces Metal-Semiconductor Contact Degradation (RWTH Aachen) - 11-26
  • Randomized Caches in HW: Overheads And Limitations (RUB, Max Planck, Georgia Tech) - 11-26
  • Fast, Sub-Volt HZO Ferroelectric Capacitors For DRAM-Like Memory (SNU) - 11-26
  • AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE) - 11-26
  • 3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB) - 11-26
  • Quantum Interconnects Link Two 120-Qubit Processors (IBM Research) - 11-26
  • Hardware Defense Blocks Memory-Dependent Prefetcher Leakage (KU Leuven) - 11-26
Show More »

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