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Design & Verification

• Co-Optimizing Access Points Improves Analog Placement (UT Austin)

  Published on November 2, 2026

• Neural Networks Speed 3nm Nanosheet SPICE Simulation (TU Munich)

  Published on October 25, 2026

• Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)

  Published on October 19, 2026

• A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)

  Published on October 18, 2026

• Agentic AI Automates RTL Waveform Analysis And Debugging (Columbia, Google)

  Published on October 13, 2026

• Ultra-Compact Photonic Bends Reduce Loss While Meeting Foundry Rules (Georgia Tech)

  Published on October 6, 2026

• Backside Clock Meshes Cut Skew and Power in 2nm Nanosheets (UCSC)

  Published on October 5, 2026

• Tracing Hardware Design From Physical Devices to RTL (Infineon, TU Munich)

  Published on October 2, 2026

• Formal Automotive Security Analysis Of CAN XL (Georgia Tech, QCRI, Purdue)

  Published on October 2, 2026

• Comparing A7 CFET and A10 Nanosheet FETs From Parasitics to Chip Reliability (TUM, UNIMORE, Applied Materials)

  Published on September 25, 2026
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