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GeezerVison is showing www.synopsys.com — Design Signoff: Trusted Golden Solution for Chip Designs | Synopsys

Synopsys
Ansys
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Synopsys and Ansys power the future of innovation—connecting silicon to systems.

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Popular Content
Multiphysics Fusion Technology for Multi-Die Designs Explained
Multiphysics Fusion Technology for Multi-Die Designs Explained
Unified multiphysics fusion helps multi-die teams validate earlier and sign off faster.
Automotive Executive Guide: Rethinking Automotive Development
Automotive Executive Guide: Rethinking Automotive Development
A guide to virtualization in software-defined vehicles for automotive leaders.
Mastering AI Chip Complexity
Mastering AI Chip Complexity
This eBook explores AI chip design trends, challenges,
and strategies for first-pass silicon success.
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Multiphysics Fusion Technology for Multi-Die Designs Explained
Multiphysics Fusion Technology for Multi-Die Designs Explained

Unified multiphysics fusion helps multi-die teams validate earlier and sign off faster.

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Synopsys Signoff Banner

Design Signoff

Design Signoff

The Trusted, Golden Solution for Leading-Edge Chip Designs

  • Overview
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  • What's New
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Accelerate Design Closure

Synopsys' design analysis and signoff solution includes a broad portfolio of products for static timing analysis, advanced signal integrity, power and power integrity, parasitic extraction, ECO closure, transistor-level analysis and library characterization, and multiphysics. With an extensive investment in golden signoff solutions, designers can address comprehensive multiphysics challenges, including thermal, electromagnetic, and reliability effects. Now, agentic signoff solutions build on this foundation to orchestrate signoff tasks across tools—automating setup, execution, triage, root-cause analysis, and fix guidance—to accelerate closure. The native integration of signoff technologies with IC Compiler™ II and Fusion Compiler allows physical designers to confidently realize the full performance-power-area (PPA) potential of the design with the fastest path to design closure.

Key Benefits

Addresses Design Challenges Complexity, scale and advanced process nodes
Broad and Integrated Portfolio State-of-the-art design analysis and signoff products
Trusted Golden Signoff Powerful AI and machine learning technologies

What's New

Efficient and Robust Memory Verification in Modern SoCs Using Formal Equivalence Checker
Webinar

Efficient and Robust Memory Verification in Modern SoCs Using Formal Equivalence Checker

Watch
Achieving Consistent RTL Power Analysis Accuracy
Webinar

Achieving Consistent RTL Power Analysis Accuracy

Watch Now
Achieve Out-of-the-Box Equivalence Checking with Synopsys Formality ML-driven Distributed Processing
Webinar

Achieve Out-of-the-Box Equivalence Checking with Synopsys Formality ML-driven Distributed Processing

Watch Now
CPU and Computer chip concept
Blog

Automated Late Stage Timing-Aware Dynamic Voltage Drop ECO

Read Now
Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems
Blog

Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems

Read Now
Power Designs (abstract)
Blog

New Unified Electrostatic Reliability Analysis Solution Has Your Chip Covered

Read Now

Portfolio Overview

Timing & ECO Closure
Transistor-level Signoff
Power & Power-Integrity Closure
Library Characterization
Parasitic Modeling & Extraction
Multiphysics
Agentic
Timing & ECO Closure + -

Timing and ECO Closure

Synopsys’ PrimeTime® solution delivers fast, memory-efficient scalar and multicore static timing analysis, distributed multi-scenario analysis and ECO fixing using POCV and variation-aware modeling.

Synopsys PrimeClosure is the industry’s first AI-driven golden signoff ECO closure solution and is  integrated with industry-golden Synopsys PrimeTime Static Timing Analysis and Synopsys Fusion Compiler™ RTL-to-GDSII implementation solution to accelerate electronic-design power-performance-area closure time-to-results (TTR).

Synopsys PrimeShield solution provides the industry’s fastest design robustness analysis solution built on golden PrimeTime STA and accelerated with breakthrough machine learning technology.

Synopsys PrimeClock, the latest innovation in the PrimeTime family, is purpose-built to scientifically analyze and optimize clock jitter and structural integrity in 2GHz–5GHz designs, helping teams recover critical performance margin to improve performance and yield.

Timing and ECO Closure
Transistor-level Signoff + -

Transistor-level Signoff

Synopsys NanoTime is the golden timing signoff solution for transistor-level design for CPU datapaths, embedded memories and complex AMS IP blocks. 

Its seamless integration with Synopsys’ PrimeTime® product enables full-chip analysis of designs that includes both gate- and transistor-level blocks. Synopsys NanoTime is a key component of the Synopsys custom design verification solution that includes Synopsys CustomSim® and HSPICE for circuit simulation and Synopsys ESP for symbolic simulation-based equivalence checking.

Synopsys Totem and Totem-SC is a transistor-level power integrity platform for voltage-drop (IR drop) and electromigration (EM) signoff of analog mixed-signal (AMS) IP and full-custom designs.

Transistor-level Signoff
Power & Power-Integrity Closure + -

Power and Power-Integrity Closure

Synopsys PrimePower analyzes power dissipation for block and full-chip designs starting from RTL, through implementation, and leading to power signoff.

Synopsys RedHawk-SC is the industry’s trusted gold standard voltage-drop (IR-drop) and electromigration (EM) multiphysics sign-off solution for digital designs.​

Synopsys PathFinder-SC is a high-capacity signoff platform for verifying theprotective circuitry found on all chips that protect them from electrostaticdischarge (ESD) and damage from voltage spikes.

Power and Power-Integrity Closure
Library Characterization + -

Library Characterization

The Synopsys SiliconSmart® solution provides fast, accurate, and advanced node proven library characterization for standard cells, I/O and memory.  Synopsys PrimeLib is the next-generation, unified library characterization and validation solution, providing ultra-fast, signoff-quality libraries and is optimized for scaling and performance for cloud and cluster computing workloads.

Synopsys SiliconSmart and Synopsys PrimeLib innovative technologies utilize embedded gold-reference SPICE engines to provide a characterization speed-up of advanced Liberty models used by Synopsys PrimeTime static timing analysis to accurately account for effects seen in ultra-low-voltage FinFET processes that impact timing.

Library Characterization
Parasitic Modeling & Extraction + -

Parasitic Modeling and Extraction

The Synopsys StarRC™ solution provides golden signoff parasitic extraction for silicon accurate results supporting advanced foundry nodes and design flows.​

The Synopsys QuickCap® NX solution is the golden extraction reference tool for advanced node process modeling and high accuracy library characterization.

Synopsys VeloceRF provides an inductive device synthesis and modeling tool for custom inductors, transformers, baluns, and transmission lines. ​

Synopsys Exalto enables accurate modeling of electromagnetic coupling and capture electromagnetic crosstalk during the signoff phase on circuits that were previously considered too big to analyze.

Synopsys ParagonX and PrimeX addresses the increasing impact of layout parasitics on performance, accuracy, power, robustness, and reliability, for analog and mixed-signal designs.​

Synopsys PowerX provides intelligent analysis and visualization for PowerFETs and PowerManagement ICs (PMICs)​

Synopsys RaptorQu delivers silicon-optimized electromagnetic modeling for quantum and cryogenic computing.

Synopsys RedHawk-SC Security performs a pre-silicon assessment to measure side-channel vulnerabilities and assess the most effective design countermeasures.

Parasitic Modeling and Extraction
Multiphysics + -

Multiphysics

Synopsys RedHawk-SC Electrothermal is a multiphysics simulation platform for 2.5/3D-ICs, interposers, chiplets, and multi-die packages. Based on Synopsys golden solvers, it analyzes thermal integrity (TI), power integrity (PI), electromagnetic signal integrity (SI), electromagnetic coupling (EMC), and thermomechanical structural integrity.

Multiphysics
Agentic + -

Agentic

Synopsys’ agentic signoff capabilities use AgentEngineer workflows to orchestrate end-to-end signoff across timing, power, power integrity, reliability, constraints and ECO closure. They automate setup and execution, correlate results across tools, triage violations, trace root cause, and recommend targeted fixes—helping teams converge faster with signoff-grade confidence and fewer late-stage surprises.

Watch our video on how our The PrimeTime Vmin Optimization Agent autonomously discovers available timing and voltage margins, identifies Vmin-limiting paths and conditions, and drives targeted ECO optimizations to achieve the lowest safe operating voltage. Through a closed-loop timing and ECO closure workflow, the agent accelerates Vmin convergence while maintaining signoff-quality confidence and design integrity.

Products

  • Timing and ECO Closure
    • PrimeTime
    • PrimeClock
    • PrimeClosure
    • PrimeShield
  • Library Characterization​
    • SiliconSmart​
    • PrimeLib​
  • Transistor-level Signoff​
    • NanoTime​
    • ESP
    • Totem/Totem-SC​
  • Parasitic Modeling and Extraction​
    • StarRC​
    • QuickCap NX​
    • VeloceRF
    • ParagonX
    • PrimeX
    • PowerX​
    • Exalto​
    • RaptorQu​
    • RedHawk-SC Security​
  • Power and Power- Integrity Closure​
    • RedHawk-SC​
    • PathFinder-SC​
    • PrimePower​
    • IC Compiler II​
    • Fusion Compiler​
  • Multiphysics
    • RedHawk-SC Electrothermal​

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