To realize best system performance for the target workloads, designers must efficiently explore the appropriate partitions and system-level interconnect fabric. Reusing IP effectively to meet time-to-market and ensuring testability are among some of the challenges that require fast and early analysis-driven exploration. With early architecture exploration and analysis, system designers can optimize partitioning for the best performance, minimize interconnect traffic, and perform efficient power and thermal planning.

Software teams can quickly develop, integrate, and test the software by having access to proven virtual die models. Assembling virtual models in a virtual platform allows for early multi-die software bring-up, debug, and analysis. As dies become available they can be executed on hardware-assisted verification platforms that are enabled with large capacity and modularity features to efficiently handle the complexity of multi-die designs within the required turnaround time. Software can run large amounts of software and AI workloads in lockstep with the hardware using a unified, hybrid emulation and prototype environment, and assess power and performance metrices for the target application.

For seamless 2.5D and 3D heterogeneous integration, designers need a unified multi-die/advanced package co-design platform with multiphysics analysis capabilities. This platform supports feasibility exploration, partitioning, prototyping, and floorplanning, and enables automation for 3D construction and advanced packaging including analysis-driven routing for high-speed interfaces. Designers can optimize for power and signal integrity, thermal and mechanical stress, as well as signoff verification.

Die-to-die connectivity IP, allows high-bandwidth, low power, and robust links between heterogeneous and homogeneous dies in a single 2.5D or 3D multi-die design. 3D-enabled interface IP can help minimize power and latency of chip-to-chip connectivity supporting various die topologies in a 3D stacked design. High-quality, complete controller, PHY, and verification IP solutions that are silicon proven, have achieved interoperability with ecosystem products, and are compliant with the most widely used standards, can minimize integration risk and accelerate time to market. IP integrated in configurable, pre-verified IP subsystems deliver complete, complex functions that are ready to integrate into SoCs or chiplets.

Designers can help improve long-term health and reliability by testing, diagnosing, repairing, and improving operational metrics at every phase of the multi-die lifecycle. In addition, access to traceability and analytics across the dies for in-design, in-ramp, in-production and in-field optimization can help designers improve cost, quality, and reliability. Ensuring that top-quality, high-performance dies are properly binned during package assembly is critical.