With a comprehensive and seamless HPC and data center solution, Synopsys provides access to the most essential technologies for design and implementation, silicon IP, optical interconnects, and verification from silicon to software. The solution helps you deliver designs with maximum security, reliability, and power efficiency while enabling fast heterogeneous 2.5D and 3D system integration in advanced packaging technologies. Synopsys collaborates with leading ecosystem partners to enhance the solution with specific capabilities that help you achieve silicon success for HPC and data center applications such as AI, servers, edge computing, networking, and storage.

Synopsys helps you deliver innovative HPC and data center systems with optimized design targets. The Synopsys end-to-end solution consists of a broad portfolio of low-latency, silicon-proven IP, along with SoC architectural exploration-to-signoff platforms that help optimize power, area, yield, and throughput. In addition, designers can leverage Synopsys' 3DIC solution to achieve higher levels of system integration for multi-die system-in-package designs. To address security concerns, Synopsys offers comprehensive hardware and software solutions. To ensure reliability at each phase of the device lifecycle, Synopsys provides an integrated solution for real-time monitoring and data-driven analytics.

To help improve your team's productivity, Synopsys' end-to-end HPC and data center solution provides an AI-driven platform for chip design. In addition, the solution enables early architectural exploration and software development for hardware/software co-design, as well as early RTL exploration for improved productivity across the entire RTL-to-GDSII flow. Your engineers can focus on their core technical competencies by leveraging Synopsys' system design services, which allow efficient SoC design, IP hardening, and system optimization.