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Synopsys and Ansys power the future of innovation—connecting silicon to systems.

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Multiphysics Fusion Technology for Multi-Die Designs Explained
Multiphysics Fusion Technology for Multi-Die Designs Explained
Unified multiphysics fusion helps multi-die teams validate earlier and sign off faster.
Automotive Executive Guide: Rethinking Automotive Development
Automotive Executive Guide: Rethinking Automotive Development
A guide to virtualization in software-defined vehicles for automotive leaders.
Mastering AI Chip Complexity
Mastering AI Chip Complexity
This eBook explores AI chip design trends, challenges,
and strategies for first-pass silicon success.
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Multiphysics Fusion Technology for Multi-Die Designs Explained
Multiphysics Fusion Technology for Multi-Die Designs Explained

Unified multiphysics fusion helps multi-die teams validate earlier and sign off faster.

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Ansys Home Page
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Synopsys and Ansys power the future of innovation—connecting silicon to systems.

Multi-Die Design Resources

Multi-Die Design Resources

Explore Featured Multi-Die Insights

White Paper

Co-Packaged Optics for Multi-Die Designs

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Hardware-Assisted Verification for Multi-Die Designs: Enabling Scalable Silicon-to-System Validation
White Paper

Hardware-Assisted Verification for Multi-Die Designs: Enabling Scalable Silicon-to-System Validation

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Webinar

Google: Scaling HBM Signal Integrity Signoff for Large‑Scale 2.5D Packages with Parallel Analysis

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Blogs
eBooks
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Blogs + -

Explore Our Blogs

Why Co-Packaged Optics Is Becoming Essential for AI and HPC Multi-Die Designs

Multi-Die, Multiphysics, and the New Rules of Chip Design

Designing the Future We Can Verify: A Vision for Multi-Die Design, STCO, and Trustworthy AI

Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out

Safety-Aware Multi-Die ML Architectures for the AI-Defined Vehicle: Synopsys & SiMa.ai

World’s First HBM4 IP Test Chip: Early Silicon Validation for Next-Generation AI and HPC

Advancing UCIe Performance: Enabling 40G for Next-Generation Multi-Die Designs

Multi‑Die Design in Context: A Clear Comparison with Monolithic and PCB Designs

Interface IP: The Keystone for 3D Multi-Die Designs

Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design

Designing the Future: How 3DIC Compiler Is Powering Breakthroughs Across the MultiDie Design Landscape

Visualizing Cross-Die Paths in Multi-Die Designs

How Multi-Die Designs Boost Automotive Chip Innovation

A Beginner’s Guide to Chiplets: 8 Best Practices for Multi-Die Designs

Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?
eBooks + -

Explore Our eBooks

Innovate Faster with Synopsys Multi-Die Solution

Multiphysics Fusion Technology for Multi-Die Designs Explained
Podcasts + -

Explore Our Podcasts

Multi-Die: Insights and Customer Requirements

The Journey to Multi-Die and Chiplet Design with Robert Kruger of Synopsys

What You Need to Know about the Advancements in UCIe

The Ojo-Yoshida Report: Dig Deeper: EDA's Role in Chiplets

EE Journal: How Multi-Die Systems Will Drive Next Generation Semiconductor Innovation
Videos + -

Explore Our Videos

Accelerate Multi-Die Fanout Routing with 3DIC Compiler

Full Flow HBM Channel Prototyping, Implementation and Analysis wtih 3DIC Compiler

Multi-Die PG Bump Optimization with Synopsys 3DIC Compiler

Socionext’s 3DIC Breakthrough with Synopsys: Two Tape‑Outs in 7 Months for AI & HPC

Designing the Future Today: AI-Driven Multi-Die Design

Synopsys 40G UCIe Product Update

Die-To-Die Security

Multi-Die Integration
Webinars + -

Explore Our Technical Webinars

Powering 3D Multi-Die Designs with RedHawk-SC Electrothermal

UCIe Standard vs. UCIe Advanced: What Designers Need to Know

Accelerating Static ESD Simulation for Full-Chip and Multi-Die Designs with Synopsys PathFinder-SC

The A to Z of Multi-Die Design

How to Approach Security for Multi-Die Designs

Key IP Requirements for 3D Integration and UCIe in AI Chips

Synopsys and TSMC Discuss Multi-Die Monitoring, Embedded Test & Repair Flows

Explore Our Customer Success Webinars

Google: Scaling HBM Signal Integrity Signoff for Large‑Scale 2.5D Packages with Parallel Analysis

Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools

Intel: From Construction to Signoff: 3DIC Methodology for Disaggregated Designs

Marvell: Accelerating Interposer Design with Early Signal Integrity Analysis

Meta: Multi-Die Partitioning and Floorplanning Prior to Netlist Using 3DIC Compiler

Intel Presents: Modern EDA Solutions for Scalable Heterogeneous Systems

AMD Presents: 3D Odyssey - Navigating the Depths of 3DIC Feasibility Analysis
White Papers + -

Explore Our White Papers

Multi-Die Start Guide

Co-Packaged Optics for Multi-Die Designs

Hardware-Assisted Verification for Multi-Die Designs: Enabling Scalable Silicon-to-System Validation

The Evolution and Requirements of IP for 3D Multi-Die Designs

Multi-Die Design for Automotive Applications

Minimizing Design Risk: Rapid Feasibility Exploration for Multi-Die Designs

Automated High-Speed Interface Routing in Multi-Die Designs

How to Create Efficient Bump and TSV Plans for Multi-Die Designs

What Designers Need to Know About Advanced Packaging for Multi-Die Designs

Multi-Die Design for HPC Applications

Addressing Physical Verification for Multi-Die Designs

Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs

Effective Monitoring, Test, and Repair of Multi-Die Designs

Enabling Efficient Multi-Die Design Implementation and IP Integration

Overcoming the Challenges of Verifying Multi-Die Designs

Early Architecture Performance and Power Analysis of Multi-Die Designs

Pre-Silicon Verification of Die-to-Die IP with Novel ESD Protection

Connect With Us

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